IUMRS-ICEM 2026

the International Union of Materials Research Societies
The 19th International Conference on Electronic Materials 2026

28 June - 1 July 2026 , The Empress Convention Center, Chiang Mai, THAILAND

Organization Image

Semiconductors, Photonic Materials and Devices

Speakers

Speaker
Prof. Li-Chyong Chen

Center for Condensed Matter Sciences & Center of Atomic Initiative for New Materials, National Taiwan University, Chinese Taipei

Keynote Speaker

Abstract:
Transition Metal Dichalcogenides as Emerging Semiconductors: Growth, Doping/Alloying, Optical Properties, and Light-driven Applications

Speaker
Prof. Sinn-Wen Chen

President of MRS-Taiwan, National Tsing Hua University (NTHU)

Keynote Speaker

Abstract:
TBA

Speaker
Prof. Ana Cecilia Noguez Garrido

National Autonomous University of Mexico, Mexico

Keynote Speaker

Abstract:
Structure–Chirality–Optical Response Relationships in Semiconducting Carbon Nanotubes

Speaker
Assoc. Prof. Dr. Sakon Rahong

King Mongkut's Institute of Technology Ladkrabang, Thailand

Invited Speaker

Abstract:
TBA



Chairs:
Assoc. Prof. Dr. Anucha Watcharapasorn, Chiang Mai University

Co-chairs:
Prof. Dr. Wisanu Pecharapa, King Mongkut's Institute of Technology Ladkrabang
Assoc. Prof. Dr. Doldet Tantraviwat, Chiang Mai University
Dr. Tossaporn Lertvanithphol, National Electronics and Computer Technology Center

 

Symposium topics include (but not limited to):

- Elemental/Compound Semiconductors and Photonics, Narrow- and Wide-Bandgap Semiconductor and Photonic Materials, Heterostructures and Superlattices, Low dimensional structure: Si, Ge, III-V, II-VI, IV-VI, etc.,

- Semiconductor and Photonics Fabrication and Processing: Bulk Single Crystal Growth Techniques, Thin Film Techniques, Chemical Vapor Deposition, Vapor Phase Epitaxy, Liquid Phase Epitaxy, Pulse Laser Deposition, Molecular Beam Epitaxy, Atomic Layer Deposition, Evaporation and Sputtering, Self-assembly, Lithography and Patterning, Metallization, Bonding

- Semiconductor and Photonics Characterization, Defects Investigation, Reliability Testing

- Semiconductor and Photonics Packaging Technologies, system-in-package (SiP), Chiplets

- Semiconductor and Photonics Devices: Diodes, Field-effect Transistors (e.g. Ferroelectric FETs, MOSFETs, FinFET, GAAFET),  Lasers (Quantum Cascade Lasers (QCLs), Vertical-Cavity Surface Emitting Lasers (VCSELs)), Photodetectors, Chip Design and Implementation, Lab-on-a-chip, Microelectromechanical (MEMS) Devices, Optoelectronic Devices, Micro/Nano Sensor Materials and Devices, VLSI (Very Large-Scale Integration) and ULSI (Ultra-Large-Scale Integration), Wave Guide, Electro-chromic Devices, Thermo-chromic Devices, Photo-chromic Devices, SiC/GaN power system, Power Management Integrated Circuits, Integrated Photonics, On-chip Optical Links, Resistive RAM (ReRAM)

- Semiconductor and Photonics Clean Room Technologies